CNC Gallium Arsenide Wafer Polisher-Grinder from China
Numerically controlled combination grinder-polisher for gallium arsenide compound semiconductor wafers, achieving surface finish for epitaxial growth. HTS 8460.24.00.80 as NC abrasive finishing machine for cermets per statistical notes covering gallium arsenide processing.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Specify GaAs compatibility and epitaxial surface finish specs (RMS roughness values)