CNC Semiconductor Wafer Surface Lapper from Japan
A numerically controlled lapping machine that achieves ultra-flat wafer surfaces critical for semiconductor fabrication by using abrasive slurries on metal or cermet surfaces. Falls under HTS 8460.24.00.80 as an NC grinding/lapping machine for finishing semiconductor wafers, distinct from gear finishing. Essential for bringing wafers within tight dimensional tolerances as per statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include detailed process descriptions showing lapping for flatness tolerances in semiconductor wafer prep to distinguish from general polishing machines
• Label as 'semiconductor wafer processing equipment' on commercial invoice for proper statistical reporting