Precision CNC Wafer Backside Grinder from China
Numerically controlled grinder that thins semiconductor wafers from the backside to target thickness (typically 50-775 microns) using diamond abrasives on metal/cermet surfaces. Falls under HTS 8460.24.00.80 as NC grinding machine for semiconductor wafer finishing per statistical notes on wafer grinders.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document thickness reduction capability and wafer size range (200mm, 300mm, 450mm) to verify semiconductor application
• Include stress relief grinding specifications to distinguish from simple thickness reduction machines