Precision CNC Wafer Backside Grinder from Canada
Numerically controlled grinder that thins semiconductor wafers from the backside to target thickness (typically 50-775 microns) using diamond abrasives on metal/cermet surfaces. Falls under HTS 8460.24.00.80 as NC grinding machine for semiconductor wafer finishing per statistical notes on wafer grinders.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document thickness reduction capability and wafer size range (200mm, 300mm, 450mm) to verify semiconductor application
• Include stress relief grinding specifications to distinguish from simple thickness reduction machines