Precision CNC Wafer Backside Grinder from Japan
Numerically controlled grinder that thins semiconductor wafers from the backside to target thickness (typically 50-775 microns) using diamond abrasives on metal/cermet surfaces. Falls under HTS 8460.24.00.80 as NC grinding machine for semiconductor wafer finishing per statistical notes on wafer grinders.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document thickness reduction capability and wafer size range (200mm, 300mm, 450mm) to verify semiconductor application
• Include stress relief grinding specifications to distinguish from simple thickness reduction machines