Semiconductor Wafer Edge Grinder Wheel
Diamond-impregnated edge grinding wheel for beveling and rounding wafer edges post-slicing to prevent chipping during handling and processing. Part of wafer grinder equipment under HTS 8451.90.90 statistical notes for semiconductor preparation. Achieves precise edge profiles for 200-450mm wafers.
Import Duty Rates by Country of Origin
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If interchangeable diamond grinding wheels for general use
Tools for working in the hand classified separately from machine parts.
If millstones of agglomerated synthetic diamonds
Abrasive products of agglomerated synthetic materials in Chapter 68.
If parts of general grinding machines not semiconductor-specific
Parts and accessories of machine tools for grinding under heading 8466.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Specify grind wheel profile (e.g
• full arc, truncated cone) and wafer diameter range
• Provide edge chip prevention test data linking to semiconductor handling standards
Related Products under HTS 8451.90.90
Crystal Grinder for Semiconductor Boules
Precision crystal grinder designed to grind semiconductor crystal boules, such as silicon, to exact diameters and flats indicating conductivity type and resistivity, as defined in statistical notes for wafer preparation equipment. Classified under HTS 8451.90.90 as a part of machinery for processing semiconductor materials akin to textile finishing processes. Essential for preparing boules before wafer slicing in semiconductor manufacturing.
Wafer Slicing Diamond Saw Blade
High-precision diamond saw blade part for wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers, per statistical notes under wafer preparation equipment. Falls under HTS 8451.90.90 as replaceable parts of specialized cleaning/processing machinery for semiconductor 'fabrics' (wafers). Ensures damage-free slicing for subsequent fabrication processes.
Semiconductor Wafer Lapping Plate
Cast iron or ceramic lapping plate used in wafer grinders/lappers to achieve precise flatness and dimensional tolerances on semiconductor wafers before fabrication. Covered under HTS 8451.90.90 as parts of wafer preparation equipment analogous to textile finishing machinery. Critical for surface preparation in crystal growers/puller production lines.
Czochralski Crystal Puller Heating Element
Graphite or molybdenum heating element part for Czochralski method crystal growers/pullers producing monocrystalline silicon boules from which wafers are sliced. HTS 8451.90.90 as parts of semiconductor growth equipment under statistical note (a)(i). Maintains precise melt temperatures for defect-free crystal growth.
Float Zone Crystal Furnace RF Coil
Radio frequency induction coil part for float zone method crystal pullers creating ultra-pure silicon boules for wafer production, per statistical notes. Classified HTS 8451.90.90 as parts of specialized semiconductor processing machinery. Provides zone melting without crucible contamination.
Wafer Polishing Pad for CMP Machines
Polyurethane polishing pad replacement part for chemical mechanical planarization (CMP) of semiconductor wafers, achieving mirror finish surface flatness required before device fabrication. HTS 8451.90.90 as finishing parts under wafer preparation/grinding statistical notes. Removes microns of material uniformly across 300mm wafers.