Other
Machinery (other than machines of heading 8450) for washing, cleaning, wringing, drying, ironing, pressing (including fusing presses), bleaching, dyeing, dressing, finishing, coating or impregnating textile yarns, fabrics or made up textile articles and machines for applying the paste to the base fabric or other support used in the manufacture of floor coverings such as linoleum; machines for reeling, unreeling, folding, cutting or pinking textile fabrics; parts thereof: > Parts: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Subheadings
Products classified under HTS 8451.90.90
Crystal Grinder for Semiconductor Boules
Precision crystal grinder designed to grind semiconductor crystal boules, such as silicon, to exact diameters and flats indicating conductivity type and resistivity, as defined in statistical notes for wafer preparation equipment. Classified under HTS 8451.90.90 as a part of machinery for processing semiconductor materials akin to textile finishing processes. Essential for preparing boules before wafer slicing in semiconductor manufacturing.
Wafer Slicing Diamond Saw Blade
High-precision diamond saw blade part for wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers, per statistical notes under wafer preparation equipment. Falls under HTS 8451.90.90 as replaceable parts of specialized cleaning/processing machinery for semiconductor 'fabrics' (wafers). Ensures damage-free slicing for subsequent fabrication processes.
Semiconductor Wafer Lapping Plate
Cast iron or ceramic lapping plate used in wafer grinders/lappers to achieve precise flatness and dimensional tolerances on semiconductor wafers before fabrication. Covered under HTS 8451.90.90 as parts of wafer preparation equipment analogous to textile finishing machinery. Critical for surface preparation in crystal growers/puller production lines.
Czochralski Crystal Puller Heating Element
Graphite or molybdenum heating element part for Czochralski method crystal growers/pullers producing monocrystalline silicon boules from which wafers are sliced. HTS 8451.90.90 as parts of semiconductor growth equipment under statistical note (a)(i). Maintains precise melt temperatures for defect-free crystal growth.
Float Zone Crystal Furnace RF Coil
Radio frequency induction coil part for float zone method crystal pullers creating ultra-pure silicon boules for wafer production, per statistical notes. Classified HTS 8451.90.90 as parts of specialized semiconductor processing machinery. Provides zone melting without crucible contamination.
Wafer Polishing Pad for CMP Machines
Polyurethane polishing pad replacement part for chemical mechanical planarization (CMP) of semiconductor wafers, achieving mirror finish surface flatness required before device fabrication. HTS 8451.90.90 as finishing parts under wafer preparation/grinding statistical notes. Removes microns of material uniformly across 300mm wafers.
Semiconductor Wafer Edge Grinder Wheel
Diamond-impregnated edge grinding wheel for beveling and rounding wafer edges post-slicing to prevent chipping during handling and processing. Part of wafer grinder equipment under HTS 8451.90.90 statistical notes for semiconductor preparation. Achieves precise edge profiles for 200-450mm wafers.
Crystal Boule Flattener Attachment
Precision flattener tool attachment for grinding flats on semiconductor crystal boules to indicate resistivity and dopant type. HTS 8451.90.90 part of crystal grinder equipment per statistical note (a)(ii)(A). Creates industry-standard flat orientations on 200-300mm diameter boules.
Wafer Backside Grinder Diamond Wheel
Specialized diamond grinding wheel for thinning semiconductor wafer backside from 775μm to 50-100μm for advanced packaging applications. Part of wafer grinder equipment under HTS 8451.90.90 statistical provisions. Maintains total thickness variation (TTV) <1μm across wafer.
Double-Sided Wafer Lapper Ring
Conditioning ring for double-sided lapping machines processing semiconductor wafers simultaneously on both surfaces for ultimate flatness. HTS 8451.90.90 as lapping equipment parts per statistical notes. Distributes slurry evenly across multiple wafers in carrier plates.
Crystal Ingot Notcher Blade
Ultra-thin diamond notcher blade for creating orientation notches on semiconductor crystal ingots/boules before slicing. Part of boule preparation equipment under HTS 8451.90.90 statistical note (a)(ii). Ensures precise wafer crystal orientation for device fabrication.
Silicon Wafer Cleaning Brush Roller
PVA sponge brush roller part for post-grinding chemical cleaning stations removing slurry residue from semiconductor wafer surfaces. HTS 8451.90.90 as washing/cleaning machinery parts for wafer preparation. Critical for particle-free surfaces before lithography.
Gallium Arsenide Wafer Polisher Platen
Ceramic platen for chemical polishing compound III-V wafers like GaAs requiring special surface chemistry. Part of wafer polishing equipment HTS 8451.90.90 statistical notes. Achieves sub-nanometer surface roughness for optoelectronic applications.
Wafer Carrier Plate for Lapping
Precision-machined carrier plate holding multiple semiconductor wafers during simultaneous double-sided lapping operations. HTS 8451.90.90 part of lapping/grinding equipment per statistical notes. Maintains wafer spacing and planarity during material removal.
InP Crystal Grinder Chuck
Vacuum or magnetic chuck for securing Indium Phosphide crystal boules during precision diameter grinding. Part of crystal grinder equipment HTS 8451.90.90 statistical note (a)(ii)(A). Accommodates fragile III-V compound crystals prone to cracking.