Wafer Polishing Pad for CMP Machines
Polyurethane polishing pad replacement part for chemical mechanical planarization (CMP) of semiconductor wafers, achieving mirror finish surface flatness required before device fabrication. HTS 8451.90.90 as finishing parts under wafer preparation/grinding statistical notes. Removes microns of material uniformly across 300mm wafers.
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More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If rubber polishing pads not specific to semiconductor wafers
Other articles of vulcanized rubber without specialized wafer finishing function.
If parts of complete wafer fabrication CMP systems
Semiconductor manufacturing machine parts directly under 8486 statistical provisions.
If classified as textile transmission belting material
Impregnated textile fabrics for machinery belts could apply if pad backing emphasized.
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Import Tips & Compliance
• Include pad porosity, groove pattern specs, and CMP slurry compatibility data
• Declare pad thickness (typically 1.2-2.0mm) and wafer size compatibility
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