Wafer Polishing Pad for CMP Machines from Japan
Polyurethane polishing pad replacement part for chemical mechanical planarization (CMP) of semiconductor wafers, achieving mirror finish surface flatness required before device fabrication. HTS 8451.90.90 as finishing parts under wafer preparation/grinding statistical notes. Removes microns of material uniformly across 300mm wafers.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include pad porosity, groove pattern specs, and CMP slurry compatibility data
• Declare pad thickness (typically 1.2-2.0mm) and wafer size compatibility