8451.90.90/Wafer Polishing Pad for CMP Machines/Germany

Wafer Polishing Pad for CMP Machines from Germany

Polyurethane polishing pad replacement part for chemical mechanical planarization (CMP) of semiconductor wafers, achieving mirror finish surface flatness required before device fabrication. HTS 8451.90.90 as finishing parts under wafer preparation/grinding statistical notes. Removes microns of material uniformly across 300mm wafers.

Duty Rate — Germany → United States

13.5%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Include pad porosity, groove pattern specs, and CMP slurry compatibility data

• Declare pad thickness (typically 1.2-2.0mm) and wafer size compatibility

Wafer Polishing Pad for CMP Machines from Germany — Import Duty Rate | HTS 8451.90.90