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8451.90.90/Wafer Polishing Pad for CMP Machines/Mexico

Wafer Polishing Pad for CMP Machines from Mexico

Polyurethane polishing pad replacement part for chemical mechanical planarization (CMP) of semiconductor wafers, achieving mirror finish surface flatness required before device fabrication. HTS 8451.90.90 as finishing parts under wafer preparation/grinding statistical notes. Removes microns of material uniformly across 300mm wafers.

Duty Rate — Mexico → United States

13.5%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Include pad porosity, groove pattern specs, and CMP slurry compatibility data

• Declare pad thickness (typically 1.2-2.0mm) and wafer size compatibility

Wafer Polishing Pad for CMP Machines from Mexico — Import Duty Rate | HTS 8451.90.90