Semiconductor Wafer Edge Grinder Wheel from Mexico
Diamond-impregnated edge grinding wheel for beveling and rounding wafer edges post-slicing to prevent chipping during handling and processing. Part of wafer grinder equipment under HTS 8451.90.90 statistical notes for semiconductor preparation. Achieves precise edge profiles for 200-450mm wafers.
Duty Rate — Mexico → United States
13.5%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify grind wheel profile (e.g
• full arc, truncated cone) and wafer diameter range
• Provide edge chip prevention test data linking to semiconductor handling standards