Semiconductor Wafer Edge Grinder Wheel from Germany
Diamond-impregnated edge grinding wheel for beveling and rounding wafer edges post-slicing to prevent chipping during handling and processing. Part of wafer grinder equipment under HTS 8451.90.90 statistical notes for semiconductor preparation. Achieves precise edge profiles for 200-450mm wafers.
Duty Rate — Germany → United States
13.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify grind wheel profile (e.g
• full arc, truncated cone) and wafer diameter range
• Provide edge chip prevention test data linking to semiconductor handling standards