Semiconductor Wafer Edge Grinder Wheel from China
Diamond-impregnated edge grinding wheel for beveling and rounding wafer edges post-slicing to prevent chipping during handling and processing. Part of wafer grinder equipment under HTS 8451.90.90 statistical notes for semiconductor preparation. Achieves precise edge profiles for 200-450mm wafers.
Duty Rate — China → United States
38.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Specify grind wheel profile (e.g
• full arc, truncated cone) and wafer diameter range
• Provide edge chip prevention test data linking to semiconductor handling standards