Semiconductor Wafer Edge Grinder Wheel from Japan
Diamond-impregnated edge grinding wheel for beveling and rounding wafer edges post-slicing to prevent chipping during handling and processing. Part of wafer grinder equipment under HTS 8451.90.90 statistical notes for semiconductor preparation. Achieves precise edge profiles for 200-450mm wafers.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify grind wheel profile (e.g
• full arc, truncated cone) and wafer diameter range
• Provide edge chip prevention test data linking to semiconductor handling standards