Semiconductor Wafer Lapper
Wafer lappers use loose abrasives to lap both sides of semiconductor wafers simultaneously, achieving flatness critical for device fabrication. Classified HTS 8442.30.01 for printing plate preparation apparatus.
Import Duty Rates by Country of Origin
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general precision grinding/lapping for metal surfaces
Chapter 8460 for machine tools; semiconductor process specificity to 8442.
If configured for liquid abrasive centrifugal apparatus
Centrifugal liquid processing equipment in heading 8421.
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The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Provide flatness specification data (e.g
• <1μm total thickness variation)
• Document abrasive slurry composition for hazardous materials declaration
Related Products under HTS 8442.30.01
Crystal Boule Grinder
Crystal boule grinders precisely grind semiconductor boules to exact diameters and add orientation flats indicating conductivity type. Under HTS 8442.30.01 as apparatus for preparing printing cylinders or plates from semiconductor materials.
Multi-Wafer Polishing Machine
Automated multi-station polishers process dozens of semiconductor wafers simultaneously for high-volume production. HTS 8442.30.01 for printing component manufacturing equipment.
Precision Wafer Grinder
Single-side wafer grinders back-grind wafers to ultra-thin dimensions (<50μm) while maintaining die strength. Under HTS 8442.30.01 for semiconductor printing component preparation.
Semiconductor Crystal Annealer
Furnace apparatus anneals semiconductor crystals to relieve internal stresses post-growth. Classified HTS 8442.30.01 for thermal processing of printing components.
Wafer Edge Profiling Machine
Edge grinders profile semiconductor wafer edges to prevent chipping during handling and processing. HTS 8442.30.01 for printing component preparation equipment.
Double-Sided Wafer Grinder
Planetary grinders simultaneously grind both wafer sides using rotating carriers for parallel surfaces. Under HTS 8442.30.01 as printing plate preparation machinery.