Double-Sided Wafer Grinder
Planetary grinders simultaneously grind both wafer sides using rotating carriers for parallel surfaces. Under HTS 8442.30.01 as printing plate preparation machinery.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | +35.0% | 35% |
| 🇲🇽Mexico | Free | +10.0% | 10% |
| 🇨🇦Canada | Free | +10.0% | 10% |
| 🇩🇪Germany | Free | +10.0% | 10% |
| 🇯🇵Japan | Free | +10.0% | 10% |
More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If liquid abrasive surface processing machines
Other surface processing apparatus in 8428.
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Import Tips & Compliance
• Carrier rotation speed and pressure specs required
• Abrasive size progression documentation
• Size range capability (2-12 inch wafers)
Related Products under HTS 8442.30.01
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Crystal Ingot Slicer
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