Double-Sided Wafer Grinder
Planetary grinders simultaneously grind both wafer sides using rotating carriers for parallel surfaces. Under HTS 8442.30.01 as printing plate preparation machinery.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| π¨π³China | Free | +37.5% | 37.5% |
| π²π½Mexico | Free | +10.0% | 10% |
| π¨π¦Canada | Free | +10.0% | 10% |
| π©πͺGermany | Free | +10.0% | 10% |
| π―π΅Japan | Free | +12.5% | 12.5% |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general honing machines for metal
Honing/grinding metal surfaces in 8460.
If liquid abrasive surface processing machines
Other surface processing apparatus in 8428.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code β and can price the duty on it in the same conversation.
Import Tips & Compliance
β’ Carrier rotation speed and pressure specs required
β’ Abrasive size progression documentation
β’ Size range capability (2-12 inch wafers)
Related Products under HTS 8442.30.01
Crystal Boule Grinder
Crystal boule grinders precisely grind semiconductor boules to exact diameters and add orientation flats indicating conductivity type. Under HTS 8442.30.01 as apparatus for preparing printing cylinders or plates from semiconductor materials.
Multi-Wafer Polishing Machine
Automated multi-station polishers process dozens of semiconductor wafers simultaneously for high-volume production. HTS 8442.30.01 for printing component manufacturing equipment.
Precision Wafer Grinder
Single-side wafer grinders back-grind wafers to ultra-thin dimensions (<50ΞΌm) while maintaining die strength. Under HTS 8442.30.01 for semiconductor printing component preparation.
Semiconductor Crystal Annealer
Furnace apparatus anneals semiconductor crystals to relieve internal stresses post-growth. Classified HTS 8442.30.01 for thermal processing of printing components.
Wafer Edge Profiling Machine
Edge grinders profile semiconductor wafer edges to prevent chipping during handling and processing. HTS 8442.30.01 for printing component preparation equipment.
Crystal Ingot Slicer
Wire saws using diamond-impregnated wires slice entire semiconductor ingots into thousands of wafers simultaneously. HTS 8442.30.01 for multi-wire slicing apparatus.