Crystal Ingot Slicer
Wire saws using diamond-impregnated wires slice entire semiconductor ingots into thousands of wafers simultaneously. HTS 8442.30.01 for multi-wire slicing apparatus.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | +35.0% | 35% |
| 🇲🇽Mexico | Free | +10.0% | 10% |
| 🇨🇦Canada | Free | +10.0% | 10% |
| 🇩🇪Germany | Free | +10.0% | 10% |
| 🇯🇵Japan | Free | +10.0% | 10% |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general saw machine parts/accessories
Sawing machine components in 8461.
If other machinery for material processing
Catch-all machinery for unspecified processing.
Not sure which classification is right?
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Import Tips & Compliance
• Wire count, spacing, and tension specifications
• Slurry recycling system complexity affects value
• Ingot size accommodation (up to 450mm diameter)
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