Crystal Ingot Slicer from Germany
Wire saws using diamond-impregnated wires slice entire semiconductor ingots into thousands of wafers simultaneously. HTS 8442.30.01 for multi-wire slicing apparatus.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Wire count, spacing, and tension specifications
• Slurry recycling system complexity affects value
• Ingot size accommodation (up to 450mm diameter)