Crystal Ingot Slicer from Germany
Wire saws using diamond-impregnated wires slice entire semiconductor ingots into thousands of wafers simultaneously. HTS 8442.30.01 for multi-wire slicing apparatus.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Wire count, spacing, and tension specifications
• Slurry recycling system complexity affects value
• Ingot size accommodation (up to 450mm diameter)