Machinery, apparatus and equipment
Machinery, apparatus and equipment (other than the machines of headings 8456 to 8465), for preparing or making plates, cylinders or other printing components; plates, cylinders and other printing components; plates, cylinders and lithographic stones, prepared for printing purposes (for example, planed, grained or polished); parts thereof: > Machinery, apparatus and equipment
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Subheadings
Products classified under HTS 8442.30.01
Crystal Boule Grinder
Crystal boule grinders precisely grind semiconductor boules to exact diameters and add orientation flats indicating conductivity type. Under HTS 8442.30.01 as apparatus for preparing printing cylinders or plates from semiconductor materials.
Multi-Wafer Polishing Machine
Automated multi-station polishers process dozens of semiconductor wafers simultaneously for high-volume production. HTS 8442.30.01 for printing component manufacturing equipment.
Precision Wafer Grinder
Single-side wafer grinders back-grind wafers to ultra-thin dimensions (<50μm) while maintaining die strength. Under HTS 8442.30.01 for semiconductor printing component preparation.
Semiconductor Crystal Annealer
Furnace apparatus anneals semiconductor crystals to relieve internal stresses post-growth. Classified HTS 8442.30.01 for thermal processing of printing components.
Wafer Edge Profiling Machine
Edge grinders profile semiconductor wafer edges to prevent chipping during handling and processing. HTS 8442.30.01 for printing component preparation equipment.
Double-Sided Wafer Grinder
Planetary grinders simultaneously grind both wafer sides using rotating carriers for parallel surfaces. Under HTS 8442.30.01 as printing plate preparation machinery.
Crystal Ingot Slicer
Wire saws using diamond-impregnated wires slice entire semiconductor ingots into thousands of wafers simultaneously. HTS 8442.30.01 for multi-wire slicing apparatus.
Wafer Thickness Grinder
Stress-free grinders control semiconductor wafer thickness to nanometer precision using low-stress diamond wheels. Classified under HTS 8442.30.01 for printing component finishing.
Semiconductor Polishing Head Assembly
Precision polishing head units apply controlled pressure to individual wafers during CMP processing. HTS 8442.30.01 parts for printing equipment.
Automated Wafer Preparation Line
Integrated systems combining grinding, lapping, polishing for complete wafer preparation from boule. Comprehensive HTS 8442.30.01 printing component machinery.
Czochralski Crystal Puller
A Czochralski crystal puller is specialized machinery used to grow monocrystalline silicon boules from molten semiconductor material by slowly pulling a seed crystal. It falls under HTS 8442.30.01 as equipment for preparing printing components, though primarily associated with semiconductor wafer production which aligns with precise material processing apparatus in this category.
Float Zone Crystal Grower
Float zone crystal growers use a floating molten zone to purify and grow high-purity monocrystalline silicon rods for wafer slicing. Classified under HTS 8442.30.01 for its role in preparing semiconductor printing plates or components via precise crystal formation.
Wafer Slicing Diamond Saw
Inner-diameter diamond saws slice ultra-thin semiconductor wafers from monocrystalline boules with minimal kerf loss. HTS 8442.30.01 applies for equipment preparing printing components from semiconductor stock.
Semiconductor Wafer Lapper
Wafer lappers use loose abrasives to lap both sides of semiconductor wafers simultaneously, achieving flatness critical for device fabrication. Classified HTS 8442.30.01 for printing plate preparation apparatus.
Chemical Mechanical Wafer Polisher
CMP polishers use chemical slurries and polishing pads to achieve mirror-finish semiconductor wafer surfaces for lithography. Falls under HTS 8442.30.01 as equipment for final printing component preparation.