Other machinery, apparatus and equipment
Machinery, apparatus and equipment (other than the machines of headings 8456 to 8465), for preparing or making plates, cylinders or other printing components; plates, cylinders and other printing components; plates, cylinders and lithographic stones, prepared for printing purposes (for example, planed, grained or polished); parts thereof: > Machinery, apparatus and equipment > Other machinery, apparatus and equipment
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8442.30.01.50
Czochralski Crystal Puller
A Czochralski crystal puller is specialized machinery used to produce extremely pure monocrystalline silicon boules by pulling a seed crystal from molten silicon. These boules are then sliced into wafers for semiconductor fabrication. Classified under HTS 8442.30.0150 as other machinery for preparing printing components, though primarily serving semiconductor boule preparation analogous to printing plate production.
Float Zone Crystal Furnace
Float zone crystal furnaces use the float zone method to produce high-purity monocrystalline semiconductor boules without crucibles, ideal for silicon and gallium arsenide. The apparatus melts and recrystallizes a narrow zone along the boule. Falls under HTS 8442.30.0150 as other equipment for preparing printing components, with application to semiconductor wafer precursors.
Crystal Boule Grinder
Crystal boule grinders precisely grind semiconductor boules to exact diameters and create flats indicating conductivity type and resistivity. This preparation step ensures wafers sliced from the boule meet semiconductor specifications. Classified in HTS 8442.30.0150 as other machinery for preparing printing plates or components.
Semiconductor Wafer Slicing Saw
High-precision wafer slicing saws cut ultra-thin wafers from monocrystalline semiconductor boules using diamond-impregnated blades. They maintain wafer flatness and minimize subsurface damage critical for device fabrication. Under HTS 8442.30.0150 as other apparatus for preparing printing components.
Wafer Edge Grinder
Wafer edge grinders profile the circular edges of semiconductor wafers to precise geometries, preventing chipping and enabling handling equipment compatibility. Critical for wafer transport in fabs. Classified HTS 8442.30.0150 as other printing component preparation equipment.
Single-Side Wafer Lapper
Single-side wafer lappers use loose abrasive slurries to achieve precise wafer thickness and flatness on one surface simultaneously. Essential for preparing wafers before final polishing. HTS 8442.30.0150 covers this as other preparation apparatus.
Double-Side Wafer Polisher
Double-side wafer polishers simultaneously polish both wafer surfaces between rotating pads using chemical-mechanical planarization (CMP) slurries. Achieves mirror finish required for device fabrication. Under HTS 8442.30.0150 as other polishing equipment.
Semiconductor Wafer Grinder
Precision wafer grinders use diamond wheels to back-grind semiconductor wafers to final target thickness (<50μm) after device processing. Maintains wafer strength for handling. Classified HTS 8442.30.0150 as grinding apparatus.
Crystal Ingot Diameter Profiler
Automated crystal ingot diameter profilers use laser or contact measurement to grind semiconductor boules to precise cylindrical dimensions. Ensures uniform wafer thickness. HTS 8442.30.0150 as other profiling equipment.
Conductivity Flat Grinder
Conductivity flat grinders create precise flat orientations on semiconductor boules to indicate doping type (P/N) and resistivity. Primary/notch flats positioned per SEMI standards. Under HTS 8442.30.0150 classification.
boule Slicing Diamond Saw
High-precision boule slicing diamond saws use inner-diameter blades to cut semiconductor ingots into wafers with minimal kerf loss (<100μm). Maintains crystal orientation integrity. HTS 8442.30.0150 as other sawing apparatus.
Wafer Lapping Machine
Automatic wafer lapping machines use planetary motion between conditioning rings to lap multiple wafers simultaneously to precise thickness tolerances. Prepares surface for polishing. Classified HTS 8442.30.0150.
CMP Wafer Polishing Tool
Chemical Mechanical Planarization (CMP) tools polish semiconductor wafers using rotating pads and abrasive slurries to achieve atomic-level surface planarity. Essential for multi-layer device fabrication. HTS 8442.30.0150.
Ingot Profile Grinder
Ingot profile grinders create precise cylindrical profiles on semiconductor crystal ingots using CNC-controlled diamond wheels. Ensures uniform wafer thickness across boule. Under HTS 8442.30.0150.
Multi-Wafer Polishing Station
Multi-wafer polishing stations process multiple semiconductor wafers simultaneously in carrier plates between upper/lower polishing pads. High-throughput final polish step. HTS 8442.30.0150 classification.