Crystal Ingot Slicer from Japan
Wire saws using diamond-impregnated wires slice entire semiconductor ingots into thousands of wafers simultaneously. HTS 8442.30.01 for multi-wire slicing apparatus.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Wire count, spacing, and tension specifications
• Slurry recycling system complexity affects value
• Ingot size accommodation (up to 450mm diameter)