Double-Sided Wafer Grinder from Canada
Planetary grinders simultaneously grind both wafer sides using rotating carriers for parallel surfaces. Under HTS 8442.30.01 as printing plate preparation machinery.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Carrier rotation speed and pressure specs required
• Abrasive size progression documentation
• Size range capability (2-12 inch wafers)