8442.30.01/Double-Sided Wafer Grinder/Japan

Double-Sided Wafer Grinder from Japan

Planetary grinders simultaneously grind both wafer sides using rotating carriers for parallel surfaces. Under HTS 8442.30.01 as printing plate preparation machinery.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Carrier rotation speed and pressure specs required

• Abrasive size progression documentation

• Size range capability (2-12 inch wafers)