Double-Sided Wafer Grinder from Japan
Planetary grinders simultaneously grind both wafer sides using rotating carriers for parallel surfaces. Under HTS 8442.30.01 as printing plate preparation machinery.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Carrier rotation speed and pressure specs required
• Abrasive size progression documentation
• Size range capability (2-12 inch wafers)