Double-Sided Wafer Grinder from Mexico
Planetary grinders simultaneously grind both wafer sides using rotating carriers for parallel surfaces. Under HTS 8442.30.01 as printing plate preparation machinery.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Carrier rotation speed and pressure specs required
• Abrasive size progression documentation
• Size range capability (2-12 inch wafers)