Semiconductor Wafer Lapper from Japan
Wafer lappers use loose abrasives to lap both sides of semiconductor wafers simultaneously, achieving flatness critical for device fabrication. Classified HTS 8442.30.01 for printing plate preparation apparatus.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide flatness specification data (e.g
• <1μm total thickness variation)
• Document abrasive slurry composition for hazardous materials declaration