Semiconductor Wafer Lapper from Canada
Wafer lappers use loose abrasives to lap both sides of semiconductor wafers simultaneously, achieving flatness critical for device fabrication. Classified HTS 8442.30.01 for printing plate preparation apparatus.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Provide flatness specification data (e.g
• <1μm total thickness variation)
• Document abrasive slurry composition for hazardous materials declaration