Other
Parts suitable for use solely or principally with the machinery of headings 8425 to 8430: > Of machinery of heading 8425 > Other
Duty Rate (from China)
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Except for products described in headings 9903.94.06, 9903.94.32, 9903.94.33, 9903.94.42, 9903.94.43, 9903.94.44, 9903.94.45, 9903.94.52, 9903.94.53, 9903.94.54, 9903.94.55, 9903.94.62, and 9903.94.63, automobile parts, as provided for in subdivision (g) of U.S. note 33 to this subchapter
Articles of iron or steel, derivative articles of iron or steel, articles of aluminum, derivative articles of aluminum, passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks and parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks, semiconductor articles, semi-finished copper and intensive copper derivative products, wood products, or medium- and heavy-duty vehicles or medium- and heavy-duty vehicle parts, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
Products classified under HTS 8431.10.00.90
Wafer Grinder Air Bearing Pad
Porous carbon pad providing frictionless support for wafer grinding spindles in 8425 equipment. 8431.10.0090 classification maintains <0.5 micron flatness. Critical for vibration-free surface preparation.
Diamond Wafer Slicing Saw Arbor
Precision shaft holding diamond blade in wafer slicing saws of heading 8425. 8431.10.0090 part ensures spindle runout <1 micron. Hardened steel with coolant channels for continuous operation.
CMP Polisher Platen Assembly
Rotating platen holding polishing pad in chemical mechanical planarization tools for wafers. Integral part of 8425 polishers under 8431.10.0090. Composite construction for uniform pressure distribution.
Semiconductor Wafer Lapper Conditioning Ring
Diamond pellet ring for dressing lapping plates in wafer prep equipment of 8425. 8431.10.0090 part maintains plate flatness during production. Prevents glazing for consistent removal rates.
Czochralski Crystal Puller Furnace
A high-temperature furnace used in the Czochralski method to grow monocrystalline silicon boules for semiconductor wafer production. It is a part of crystal grower and puller machinery classified under HTS 8425 as semiconductor manufacturing equipment. The 'Other' subheading 8431.10.0090 applies to specialized parts not elsewhere specified for heading 8425 machinery.
Float Zone Crystal Growth Chamber
A vacuum chamber component for float zone method crystal growers, producing high-purity silicon ingots for wafers. Classed as a part for 8425 semiconductor machinery under 8431.10.0090. Ensures precise control of zone melting process in semiconductor material growth.
Semiconductor Crystal Boule Grinder
Precision grinder for shaping crystal boules to exact wafer diameters and flats indicating conductivity type. A key part of wafer preparation equipment under 8425, classified in 8431.10.0090 'Other'. Used post-growth to prepare for slicing in semiconductor fabrication.
Wafer Slicing Diamond Saw Blade
Specialized diamond-impregnated saw blade for slicing ultra-thin wafers from monocrystalline semiconductor boules. Part of wafer slicing saws in 8425 semiconductor equipment, under 8431.10.0090. Ensures minimal kerf loss and flatness for subsequent processing.
Silicon Wafer Lapping Plate
Cast iron or ceramic plate used in lapping machines to achieve flatness tolerances on semiconductor wafers post-slicing. Part for 8425 wafer preparation apparatus, in 8431.10.0090. Critical for bringing wafers within nanometer-level planarity before polishing.
Semiconductor Wafer Polishing Head
Carrier head assembly holding wafers against polishing pads in CMP (chemical mechanical planarization) tools for mirror-finish surfaces. Part of 8425 wafer polishers, classified 8431.10.0090. Achieves atomic-level flatness required for device fabrication.
Crystal Grinder Spindle Assembly
High-precision spindle with air bearings for rotating crystal boules during diameter grinding in semiconductor prep equipment. Fits 8431.10.0090 as part of 8425 grinders. Maintains sub-micron runout for accurate flat positioning.
Wafer Slicing Machine Coolant Nozzle
Sapphire or ceramic nozzle directing coolant to diamond saw during wafer slicing from silicon boules. Part of 8425 slicing saws, under 8431.10.0090. Prevents thermal damage and maintains cut quality in semiconductor production.
Boule Wafer Edge Profiling Tool
Diamond wheel assembly for profiling wafer edges post-slicing to prevent chipping in semiconductor handling. Component of 8425 wafer prep machinery in 8431.10.0090. Ensures chip-free rounded edges for fab processing.
Semiconductor Wafer Polisher Slurry Distributor
Ring manifold evenly distributing polishing slurry across wafer surface in 8425 polishers. Classified 8431.10.0090 for semiconductor-specific fluid delivery. Maintains uniform material removal rates (MRR) for planarity.
Crystal Puller RF Heating Coil
Radio frequency induction coil for melting silicon in float zone crystal pullers under 8425. Part in 8431.10.0090 provides zone-refined purity. Water-cooled copper construction for high-power operation.