Of machinery of heading 8425
Parts suitable for use solely or principally with the machinery of headings 8425 to 8430: > Of machinery of heading 8425
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8431.10.00
Wafer Slicing Saw Pulley Drive
Pulley and drive components for high-precision diamond saws that slice monocrystalline boules into semiconductor wafers. Falls under HTS 8431.10.00 per statistical note (a)(ii)(B) for wafer slicing saws as parts of 8425 heading machinery.
Silicon Ingot Puller Control Pulley
Control pulley system for automated ingot pullers in Czochralski silicon growth, regulating pull speed and rotation. HTS 8431.10.00 as part of 8425 semiconductor crystal grower per statistical notes.
Precision Wafer Polisher Lift Assembly
Elevator-style lift assembly for chemical-mechanical wafer polishers ensuring surface flatness critical for semiconductor device fabrication. Covered by HTS 8431.10.00 and statistical note (a)(ii)(C) as polisher parts of 8425 machinery.
Czochralski Crystal Puller for Wafer Production
This precision machine pulls monocrystalline silicon boules from molten silicon using the Czochralski method, essential for semiconductor wafer manufacturing. It falls under HTS 8431.10.00 as a part of semiconductor processing machinery classified in heading 8425 (pulley tackle and hoists). The statistical notes confirm crystal growers and pullers are included in wafer manufacturing equipment.
Float Zone Crystal Grower Mechanism
A specialized hoist mechanism for float zone method to produce high-purity silicon crystals by zone melting without crucibles. Classified under HTS 8431.10.00 as part of 8425 heading machinery for semiconductor boule growth per statistical notes on crystal growers.
Crystal Boule Grinder Hoist Assembly
Hoist system integrated with grinders to precisely shape semiconductor crystal boules to wafer diameters and add conductivity flats. HTS 8431.10.00 applies as part of 8425 machinery, matching statistical note (a)(ii)(A) for crystal grinders in wafer prep.
Semiconductor Wafer Lapping Hoist
Lifting hoist for wafer lappers that achieve ultra-flat surfaces on sliced wafers within tight dimensional tolerances for fabrication. HTS 8431.10.00 classification aligns with statistical note (a)(ii)(C) for wafer grinders, lappers, and polishers as 8425 parts.
Gallium Arsenide Crystal Grinder Hoist
Specialized hoist for grinding GaAs crystal boules, indicated in statistical notes, to precise diameters for compound semiconductor wafers. Classifies under HTS 8431.10.00 as 8425 machinery part.