Of machinery of subheading 8425.11 or 8425.19

Parts suitable for use solely or principally with the machinery of headings 8425 to 8430: > Of machinery of heading 8425 > Of machinery of subheading 8425.11 or 8425.19

Duty Rate (from China)

35%
MFN Base RateFree

Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

Total Effective Rate35%

Products classified under HTS 8431.10.00.10

Gallium Arsenide Crystal Puller Gearbox

Gearbox assembly for pullers producing GaAs monocrystalline boules for compound semiconductor wafers. Under HTS 8431.10.0010 as 8425.11 machinery part, statistical note covering gallium arsenide materials.

Wire Tensioner for Wafer Slicing Saws

Precision wire tensioner capstan for maintaining diamond wire tension in semiconductor wafer slicing saws. HTS 8431.10.0010 for 8425.19 saw machinery parts, statistical note (a)(ii)(B).

Boule Flattener Drive Capstan

Drive capstan for grinding flats on crystal boules to indicate conductivity type. Classifies under HTS 8431.10.0010, statistical note (a)(ii)(A).

Wafer Edge Grinder Tension Pulley

Tension pulley for edge grinders bringing wafers to dimensional tolerances. HTS 8431.10.0010, statistical note (a)(ii)(C).

Double-Sided Wafer Lapper Winch

Winch for simultaneous double-sided lapping of semiconductor wafers. HTS 8431.10.0010 for 8425.11.

CMP Polisher Carrier Capstan

Capstan for chemical mechanical polishing carriers in wafer planarization. HTS 8431.10.0010.

Crystal Ingot Puller Counterweight Assembly

Counterweight system for stable pulling in semiconductor ingot growers. HTS 8431.10.0010.

Wafer Slicing Tension Roller

Roller maintaining wire tension in boule slicing. HTS 8431.10.0010.

Precision Wafer Grinder Feed Winch

Feed winch controlling grind depth in wafer grinders. HTS 8431.10.0010.

Czochralski Crystal Puller Mechanism

This is a specialized pulling mechanism used in Czochralski crystal growers for producing monocrystalline silicon boules from which semiconductor wafers are sliced. It falls under HTS 8431.10.0010 as a part solely for machinery of subheading 8425.11 (winches and capstans), specifically crystal pullers in semiconductor manufacturing. The statistical note confirms crystal growers and pullers as wafer manufacturing equipment.

Float Zone Crystal Grower Winch Assembly

A winch assembly designed for float zone crystal growers that produce high-purity silicon rods for semiconductor wafers. Classified under HTS 8431.10.0010 as parts of 8425.11 capstan/winch machinery used in semiconductor boule processing. Aligns with statistical note (a)(i) for crystal growers employing float zone methods.

Semiconductor Wafer Slicing Saw Drive Pulley

Precision drive pulley for diamond wire wafer slicing saws that cut monocrystalline boules into semiconductor wafers. HTS 8431.10.0010 covers parts of 8425.19 capstan/winch machinery, matching statistical note (a)(ii)(B) for wafer slicing saws.

Crystal Boule Grinder Capstan Drum

Rotary capstan drum for crystal grinders that shape semiconductor boules to precise wafer diameters and flats indicating conductivity. Under HTS 8431.10.0010 for 8425.19 machinery parts, per statistical note (a)(ii)(A) for crystal grinders.

Wafer Lapping Machine Tension Winch

Tension winch for maintaining pressure in wafer lappers that achieve flatness tolerances for semiconductor fabrication. Classifies in HTS 8431.10.0010 as part of 8425.11 winch machinery, statistical note (a)(ii)(C).

Silicon Wafer Polishing Pulley System

Pulley system for semiconductor wafer polishers ensuring surface flatness critical for device fabrication. HTS 8431.10.0010 for parts of 8425.19 polishing capstan machinery, statistical note (a)(ii)(C).