Wafer Lapping Machine Tension Winch

Tension winch for maintaining pressure in wafer lappers that achieve flatness tolerances for semiconductor fabrication. Classifies in HTS 8431.10.0010 as part of 8425.11 winch machinery, statistical note (a)(ii)(C).

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8425.19.00.00Same rate: 35%

If imported as standalone tension device

Complete capstans not identified as parts go directly to 8425.19.

9031.80.80Same rate: 35%

If with integrated measuring instruments

Lapping with control functions moves to Chapter 90 measuring machines.

8431.39.00Same rate: 35%

If for non-semiconductor lapping equipment

Parts of other 8425-8430 machinery outside 8425.11/19 fall here.

Not sure which classification is right?

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Import Tips & Compliance

Include flatness tolerance specs (e.g

<1 micron) in import docs

Pair with lapping plate certification for complete classification support