Wafer Lapping Machine Tension Winch
Tension winch for maintaining pressure in wafer lappers that achieve flatness tolerances for semiconductor fabrication. Classifies in HTS 8431.10.0010 as part of 8425.11 winch machinery, statistical note (a)(ii)(C).
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If imported as standalone tension device
Complete capstans not identified as parts go directly to 8425.19.
If with integrated measuring instruments
Lapping with control functions moves to Chapter 90 measuring machines.
If for non-semiconductor lapping equipment
Parts of other 8425-8430 machinery outside 8425.11/19 fall here.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Include flatness tolerance specs (e.g
• <1 micron) in import docs
• Pair with lapping plate certification for complete classification support
Related Products under HTS 8431.10.00.10
Gallium Arsenide Crystal Puller Gearbox
Gearbox assembly for pullers producing GaAs monocrystalline boules for compound semiconductor wafers. Under HTS 8431.10.0010 as 8425.11 machinery part, statistical note covering gallium arsenide materials.
Wire Tensioner for Wafer Slicing Saws
Precision wire tensioner capstan for maintaining diamond wire tension in semiconductor wafer slicing saws. HTS 8431.10.0010 for 8425.19 saw machinery parts, statistical note (a)(ii)(B).
Boule Flattener Drive Capstan
Drive capstan for grinding flats on crystal boules to indicate conductivity type. Classifies under HTS 8431.10.0010, statistical note (a)(ii)(A).
Wafer Edge Grinder Tension Pulley
Tension pulley for edge grinders bringing wafers to dimensional tolerances. HTS 8431.10.0010, statistical note (a)(ii)(C).
Double-Sided Wafer Lapper Winch
Winch for simultaneous double-sided lapping of semiconductor wafers. HTS 8431.10.0010 for 8425.11.
CMP Polisher Carrier Capstan
Capstan for chemical mechanical polishing carriers in wafer planarization. HTS 8431.10.0010.