8431.10.00.10/Wafer Lapping Machine Tension Winch/Japan

Wafer Lapping Machine Tension Winch from Japan

Tension winch for maintaining pressure in wafer lappers that achieve flatness tolerances for semiconductor fabrication. Classifies in HTS 8431.10.0010 as part of 8425.11 winch machinery, statistical note (a)(ii)(C).

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Include flatness tolerance specs (e.g

• <1 micron) in import docs

• Pair with lapping plate certification for complete classification support

Wafer Lapping Machine Tension Winch from Japan — Import Duty Rate | HTS 8431.10.00.10