8431.10.00.10/Wafer Lapping Machine Tension Winch/Japan

Wafer Lapping Machine Tension Winch from Japan

Tension winch for maintaining pressure in wafer lappers that achieve flatness tolerances for semiconductor fabrication. Classifies in HTS 8431.10.0010 as part of 8425.11 winch machinery, statistical note (a)(ii)(C).

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include flatness tolerance specs (e.g

• <1 micron) in import docs

• Pair with lapping plate certification for complete classification support