Semiconductor Wafer Slicing Saw Drive Pulley
Precision drive pulley for diamond wire wafer slicing saws that cut monocrystalline boules into semiconductor wafers. HTS 8431.10.0010 covers parts of 8425.19 capstan/winch machinery, matching statistical note (a)(ii)(B) for wafer slicing saws.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If classified based on the diamond cutting blade rather than drive
Saw blades and metal cutting tools go to Chapter 82, separating from mechanical drive parts.
If for parts of wire saws identified as metalworking machinery
If not exclusively semiconductor, saw parts may fall under 8466 for tool parts.
If parts of fork-lift style wafer transport machinery
Shifts to 8431.20 if principally for 8427 materials handling equipment.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Submit blade tensioning specs and slicing tolerance data to prove sole use in wafer preparation
• Use HTS explanatory notes and statistical note citations in entry docs for faster processing
Related Products under HTS 8431.10.00.10
Gallium Arsenide Crystal Puller Gearbox
Gearbox assembly for pullers producing GaAs monocrystalline boules for compound semiconductor wafers. Under HTS 8431.10.0010 as 8425.11 machinery part, statistical note covering gallium arsenide materials.
Wire Tensioner for Wafer Slicing Saws
Precision wire tensioner capstan for maintaining diamond wire tension in semiconductor wafer slicing saws. HTS 8431.10.0010 for 8425.19 saw machinery parts, statistical note (a)(ii)(B).
Boule Flattener Drive Capstan
Drive capstan for grinding flats on crystal boules to indicate conductivity type. Classifies under HTS 8431.10.0010, statistical note (a)(ii)(A).
Wafer Edge Grinder Tension Pulley
Tension pulley for edge grinders bringing wafers to dimensional tolerances. HTS 8431.10.0010, statistical note (a)(ii)(C).
Double-Sided Wafer Lapper Winch
Winch for simultaneous double-sided lapping of semiconductor wafers. HTS 8431.10.0010 for 8425.11.
CMP Polisher Carrier Capstan
Capstan for chemical mechanical polishing carriers in wafer planarization. HTS 8431.10.0010.