Boule Wafer Edge Profiling Tool
Diamond wheel assembly for profiling wafer edges post-slicing to prevent chipping in semiconductor handling. Component of 8425 wafer prep machinery in 8431.10.0090. Ensures chip-free rounded edges for fab processing.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If sold as interchangeable tool bits
Interchangeable tools for hand-held grinders classify in 8207, not fixed machinery parts.
If parts of other heading 8431 bakery/fishing machinery
Mismatched principal use shifts within 8431 but wrong subheading.
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Import Tips & Compliance
• Include edge radius specs (15-30 micron); certify diamond grit size
• Pitfall: tool vs part distinction—must prove assembly integration
Related Products under HTS 8431.10.00.90
Wafer Grinder Air Bearing Pad
Porous carbon pad providing frictionless support for wafer grinding spindles in 8425 equipment. 8431.10.0090 classification maintains <0.5 micron flatness. Critical for vibration-free surface preparation.
Diamond Wafer Slicing Saw Arbor
Precision shaft holding diamond blade in wafer slicing saws of heading 8425. 8431.10.0090 part ensures spindle runout <1 micron. Hardened steel with coolant channels for continuous operation.
CMP Polisher Platen Assembly
Rotating platen holding polishing pad in chemical mechanical planarization tools for wafers. Integral part of 8425 polishers under 8431.10.0090. Composite construction for uniform pressure distribution.
Semiconductor Wafer Lapper Conditioning Ring
Diamond pellet ring for dressing lapping plates in wafer prep equipment of 8425. 8431.10.0090 part maintains plate flatness during production. Prevents glazing for consistent removal rates.
Czochralski Crystal Puller Furnace
A high-temperature furnace used in the Czochralski method to grow monocrystalline silicon boules for semiconductor wafer production. It is a part of crystal grower and puller machinery classified under HTS 8425 as semiconductor manufacturing equipment. The 'Other' subheading 8431.10.0090 applies to specialized parts not elsewhere specified for heading 8425 machinery.
Float Zone Crystal Growth Chamber
A vacuum chamber component for float zone method crystal growers, producing high-purity silicon ingots for wafers. Classed as a part for 8425 semiconductor machinery under 8431.10.0090. Ensures precise control of zone melting process in semiconductor material growth.