Boule Wafer Edge Profiling Tool from Japan
Diamond wheel assembly for profiling wafer edges post-slicing to prevent chipping in semiconductor handling. Component of 8425 wafer prep machinery in 8431.10.0090. Ensures chip-free rounded edges for fab processing.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.94.4315%Parts of passenger vehicles and light trucks that are products of Japan as provided for in subdivision (l) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent as provided for in subdivision (m) of U.S. note 33 to this subchapter.
9903.74.110%Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include edge radius specs (15-30 micron); certify diamond grit size
• Pitfall: tool vs part distinction—must prove assembly integration