Wafer Slicing Machine Coolant Nozzle
Sapphire or ceramic nozzle directing coolant to diamond saw during wafer slicing from silicon boules. Part of 8425 slicing saws, under 8431.10.0090. Prevents thermal damage and maintains cut quality in semiconductor production.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If as general mechanical fluid sprayers
Nozzles not principally for 8425 saws classify as parts of 8424 spray equipment.
If bulk ceramic tubing imports
Unmachined ceramic components without specific function go to Chapter 69.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Prove material hardness for diamond saw cooling; avoid 8424 sprayers if not machine-integrated
• Document coolant flow rates for verification
Related Products under HTS 8431.10.00.90
Wafer Grinder Air Bearing Pad
Porous carbon pad providing frictionless support for wafer grinding spindles in 8425 equipment. 8431.10.0090 classification maintains <0.5 micron flatness. Critical for vibration-free surface preparation.
Diamond Wafer Slicing Saw Arbor
Precision shaft holding diamond blade in wafer slicing saws of heading 8425. 8431.10.0090 part ensures spindle runout <1 micron. Hardened steel with coolant channels for continuous operation.
CMP Polisher Platen Assembly
Rotating platen holding polishing pad in chemical mechanical planarization tools for wafers. Integral part of 8425 polishers under 8431.10.0090. Composite construction for uniform pressure distribution.
Semiconductor Wafer Lapper Conditioning Ring
Diamond pellet ring for dressing lapping plates in wafer prep equipment of 8425. 8431.10.0090 part maintains plate flatness during production. Prevents glazing for consistent removal rates.
Czochralski Crystal Puller Furnace
A high-temperature furnace used in the Czochralski method to grow monocrystalline silicon boules for semiconductor wafer production. It is a part of crystal grower and puller machinery classified under HTS 8425 as semiconductor manufacturing equipment. The 'Other' subheading 8431.10.0090 applies to specialized parts not elsewhere specified for heading 8425 machinery.
Float Zone Crystal Growth Chamber
A vacuum chamber component for float zone method crystal growers, producing high-purity silicon ingots for wafers. Classed as a part for 8425 semiconductor machinery under 8431.10.0090. Ensures precise control of zone melting process in semiconductor material growth.