Wafer Slicing Machine Coolant Nozzle from Mexico
Sapphire or ceramic nozzle directing coolant to diamond saw during wafer slicing from silicon boules. Part of 8425 slicing saws, under 8431.10.0090. Prevents thermal damage and maintains cut quality in semiconductor production.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.94.0525%Except for products described in headings 9903.94.06, 9903.94.32, 9903.94.33, 9903.94.42, 9903.94.43, 9903.94.44, 9903.94.45, 9903.94.52, 9903.94.53, 9903.94.54, 9903.94.55, 9903.94.62, 9903.94.63, 9903.94.66 and 9903.94.67, automobile parts, as provided for in subdivision (g) of U.S. note 33 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
9903.74.100%Articles as provided for in subdivision (k) of U.S. note 38 to this subchapter
9903.74.110%Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
Import Tips
• Prove material hardness for diamond saw cooling; avoid 8424 sprayers if not machine-integrated
• Document coolant flow rates for verification