Wafer Backgrind Vacuum Station

Vacuum chuck system with integrated pumps for thinning semiconductor wafers from 775μm to <50μm during backgrinding process. HTS 8414.80.90.00 covers the precision vacuum holding critical for thin wafer handling.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China3.7%+35.0%38.7%
🇲🇽Mexico3.7%+10.0%13.7%
🇨🇦Canada3.7%+10.0%13.7%
🇩🇪Germany3.7%+10.0%13.7%
🇯🇵Japan3.7%+10.0%13.7%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8460.90.40Higher: 39.4% vs 38.7%

If classified as machine tool accessory

Semiconductor-specific vacuum chucks may have tool provisions.

8486.40.00Lower: 25% vs 38.7%

If imported with complete grinding machine

Grinding machine parts classify separately.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Document minimum wafer thickness capability (<50μm) for classification

Include vacuum pressure specs (>-90kPa) in entry documents

Provide temporary bonding/debonding process description

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