Wafer Backgrind Vacuum Station from Canada
Vacuum chuck system with integrated pumps for thinning semiconductor wafers from 775μm to <50μm during backgrinding process. HTS 8414.80.90.00 covers the precision vacuum holding critical for thin wafer handling.
Duty Rate — Canada → United States
13.7%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document minimum wafer thickness capability (<50μm) for classification
• Include vacuum pressure specs (>-90kPa) in entry documents
• Provide temporary bonding/debonding process description