8414.80.90.00/Wafer Backgrind Vacuum Station/Germany

Wafer Backgrind Vacuum Station from Germany

Vacuum chuck system with integrated pumps for thinning semiconductor wafers from 775μm to <50μm during backgrinding process. HTS 8414.80.90.00 covers the precision vacuum holding critical for thin wafer handling.

Duty Rate — Germany → United States

13.7%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document minimum wafer thickness capability (<50μm) for classification

• Include vacuum pressure specs (>-90kPa) in entry documents

• Provide temporary bonding/debonding process description

Wafer Backgrind Vacuum Station from Germany — Import Duty Rate | HTS 8414.80.90.00