Wafer Backgrind Vacuum Station from Germany
Vacuum chuck system with integrated pumps for thinning semiconductor wafers from 775μm to <50μm during backgrinding process. HTS 8414.80.90.00 covers the precision vacuum holding critical for thin wafer handling.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document minimum wafer thickness capability (<50μm) for classification
• Include vacuum pressure specs (>-90kPa) in entry documents
• Provide temporary bonding/debonding process description