Wafer Backgrind Vacuum Station from Mexico
Vacuum chuck system with integrated pumps for thinning semiconductor wafers from 775μm to <50μm during backgrinding process. HTS 8414.80.90.00 covers the precision vacuum holding critical for thin wafer handling.
Duty Rate — Mexico → United States
13.7%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document minimum wafer thickness capability (<50μm) for classification
• Include vacuum pressure specs (>-90kPa) in entry documents
• Provide temporary bonding/debonding process description