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8414.80.90.00/Wafer Backgrind Vacuum Station/Mexico

Wafer Backgrind Vacuum Station from Mexico

Vacuum chuck system with integrated pumps for thinning semiconductor wafers from 775μm to <50μm during backgrinding process. HTS 8414.80.90.00 covers the precision vacuum holding critical for thin wafer handling.

Duty Rate — Mexico → United States

13.7%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Document minimum wafer thickness capability (<50μm) for classification

• Include vacuum pressure specs (>-90kPa) in entry documents

• Provide temporary bonding/debonding process description

Wafer Backgrind Vacuum Station from Mexico — Import Duty Rate | HTS 8414.80.90.00