Wafer Backgrind Vacuum Station from Japan
Vacuum chuck system with integrated pumps for thinning semiconductor wafers from 775μm to <50μm during backgrinding process. HTS 8414.80.90.00 covers the precision vacuum holding critical for thin wafer handling.
Duty Rate — Japan → United States
13.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document minimum wafer thickness capability (<50μm) for classification
• Include vacuum pressure specs (>-90kPa) in entry documents
• Provide temporary bonding/debonding process description