Copper clad laminates
Copper foil (whether or not printed or backed with paper, paperboard, plastics or similar backing materials) of a thickness (excluding any backing) not exceeding 0.15 mm: > Backed: > Of refined copper: > Copper clad laminates
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Subheadings
Products classified under HTS 7410.21.30
Aluminum-Backed Copper Clad Laminate
Refined copper foil laminated to thin aluminum substrate for metal-core PCBs in LED lighting, foil ≤0.15mm. Still HTS 7410.21.30 as copper foil backed with metal-like 'similar backing materials' per heading.
Double-Sided 1.6mm FR4 Copper Clad Laminate
Standard 1.6mm thick FR4 laminate with refined copper foil on both sides (total foil <0.15mm), industry workhorse for PCBs. HTS 7410.21.30 for copper clad laminates of refined copper foil.
Thin Flex Copper Clad Polyimide Laminate
Ultra-thin polyimide copper clad laminate for flexible circuits, refined copper foil ≤0.15mm with adhesive backing. Classified HTS 7410.21.30 as backed refined copper clad laminates.
High-Tg FR4 Copper Clad Laminate
FR4 laminate with high glass transition temperature for lead-free soldering, clad with refined copper foil <0.15mm. HTS 7410.21.30 applies to all such refined copper clad laminates.
Copper Clad Invincible Laminate for RF
Specialty ceramic-filled laminate for RF applications with refined copper cladding ≤0.15mm thickness. Under HTS 7410.21.30 as plastics/similar backed copper clad laminates.
Rogers RO4000 Series Copper Clad Laminate
High-frequency PTFE-based laminate from Rogers Corporation clad with refined copper foil <0.15mm for RF/microwave PCBs. Specifically classified under HTS 7410.21.30 for refined copper clad laminates with plastics backing.
Single-Sided Copper Clad Laminate Panel
Large format panels of epoxy laminate with refined copper foil on one side only, thickness ≤0.15mm, cut to size for PCB fabrication. HTS 7410.21.30 explicitly includes these copper clad laminates of refined copper.
FR-4 Copper Clad Laminate Sheet
A rigid laminate sheet made from FR-4 epoxy fiberglass substrate clad with thin refined copper foil on one or both sides, thickness under 0.15 mm excluding backing. Classified under HTS 7410.21.30 as copper foil backed with insulating material forming copper clad laminates for PCB production. Meets chapter definitions for refined copper foil backed with plastics-like substrate.
Polyimide Copper Clad Laminate
High-temperature polyimide film backed with refined copper foil ≤0.15mm thick, used for flexible PCBs in electronics. Falls under HTS 7410.21.30 as backed copper foil specifically denoted as copper clad laminates with plastic backing. Refined copper per chapter alloy definitions.
CEM-1 Copper Clad Board
Copper clad laminate using cost-effective CEM-1 phenolic paper substrate with refined copper foil cladding ≤0.15mm, for single-sided PCBs. HTS 7410.21.30 covers these paper/plastics-backed refined copper foils as copper clad laminates.