Other
Copper foil (whether or not printed or backed with paper, paperboard, plastics or similar backing materials) of a thickness (excluding any backing) not exceeding 0.15 mm: > Backed: > Of refined copper: > Copper clad laminates > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 7410.21.30.60
Polyimide Copper Clad Laminate for Flex PCBs
Flexible copper clad laminate using polyimide film backed with refined copper foil ≤0.15mm thick, designed for flexible printed circuits. The copper provides conductive layers on the polymer backing. Classified under HTS 7410.21.3060 as other backed copper clad laminates of refined copper.
Thin Flex Copper Clad Polyester Laminate
Ultra-thin polyester (PET) film backed with refined copper foil under 0.15mm for flexible circuitry in wearables. Provides bendable conductive substrate. HTS 7410.21.3060 covers this other backed copper clad laminate.
High-Tg Copper Clad Laminate for Automotive PCBs
High glass transition temperature (Tg) FR4 laminate clad with refined copper foil ≤0.15mm, engineered for automotive electronics under extreme conditions. Backed substrate for reliable circuit boards. HTS 7410.21.3060 classification.
Copper Clad Kapton Laminate for Aerospace
Kapton polyimide film clad with refined copper foil under 0.15mm for high-reliability aerospace flexible circuits. Withstands extreme temperatures/vibration. Fits 7410.21.3060 other category.
Single-Sided Copper Clad Phenolic Laminate
Phenolic paper substrate with single-sided refined copper foil ≤0.15mm cladding for low-cost consumer electronics PCBs. Economical backed laminate option. HTS 7410.21.3060 applies.
Megtron6 Copper Clad Laminate for Servers
Megtron6 low-loss laminate with refined copper foil ≤0.15mm for high-speed server/data center PCBs. Advanced backing for signal integrity. Under 7410.21.3060.
Teflon Copper Clad Laminate for RF
PTFE (Teflon) ceramic-filled laminate double-clad with refined copper foil ≤0.15mm for microwave/RF applications. Superior electrical properties. HTS 7410.21.3060.
Copper Clad Invincible Glass Laminate
Thin glass-reinforced laminate with refined copper foil ≤0.15mm for rigid-flex hybrid PCBs. Innovative backing technology. 7410.21.3060 classification.
BT Resin Copper Clad Laminate for IC Substrates
Bismaleimide-triazine (BT) resin laminate clad with ultra-thin refined copper foil ≤0.15mm for semiconductor packaging substrates. High-density interconnect ready. HTS 7410.21.3060.
Hybrid Copper Clad Laminate FR4-PTFE
Hybrid stackup combining FR4 and PTFE cores with refined copper foil ≤0.15mm cladding for mixed-signal PCBs. Balances cost/performance. Other copper clad laminates 7410.21.3060.
FR-4 Copper Clad Laminate Sheet
A rigid laminate sheet made from FR-4 epoxy fiberglass substrate clad with thin refined copper foil on both sides, thickness under 0.15 mm excluding backing. Used primarily for manufacturing printed circuit boards (PCBs). Falls under HTS 7410.21.3060 as copper clad laminate of refined copper, backed, other category.
CEM-1 Copper Clad Laminate Panels
Cost-effective CEM-1 composite epoxy material clad with refined copper foil on one or both sides, foil thickness not exceeding 0.15mm. Ideal for single/double-sided PCB prototypes. HTS 7410.21.3060 applies to these other backed copper clad laminates of refined copper.
Rogers RO4000 Series Copper Clad Laminate
High-frequency RO4000 hydrocarbon ceramic laminate sheets double-clad with refined copper foil ≤0.15mm, used in RF/microwave PCBs. The advanced backing enables low-loss signal performance. Fits HTS 7410.21.3060 for other refined copper clad laminates.
Aluminum-Backed Copper Clad Laminate for LEDs
Metal-core PCB laminate with aluminum substrate backing refined copper foil ≤0.15mm thick, dissipating heat for high-power LED applications. Copper layer for circuitry traces. Classified as HTS 7410.21.3060 other copper clad laminates.
Double-Sided 1oz Copper Clad FR4 Panels
Standard FR4 glass epoxy panels with 1oz (35µm) refined copper foil clad on both sides, total foil thickness ≤0.15mm. Core material for multilayer PCB fabrication. Under HTS 7410.21.3060 as other refined copper clad laminates.