FR-4 Copper Clad Laminate Sheet
A rigid laminate sheet made from FR-4 epoxy fiberglass substrate clad with thin refined copper foil on both sides, thickness under 0.15 mm excluding backing. Used primarily for manufacturing printed circuit boards (PCBs). Falls under HTS 7410.21.3060 as copper clad laminate of refined copper, backed, other category.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If made from copper alloys like brass or bronze
Copper-zinc or copper-tin alloys shift classification to copper alloy foil backing under 7410.22, per chapter subheading note (a) or (b).
If pre-etched with circuit pattern
Insulated copper wire/film with circuitry exceeds simple clad laminate, classified as electrical insulators under Chapter 85.
If imported as plastic substrate without copper cladding
Bare plastic laminates fall under Chapter 39 as other plastics plates/sheets, lacking the copper foil essential for 7410 classification.
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Import Tips & Compliance
• Verify copper foil thickness excludes backing and is ≤0.15mm; provide lab test reports if requested by customs
• Ensure documentation proves 'refined copper' status and laminate construction to avoid reclassification to unwoven laminates
Related Products under HTS 7410.21.30.60
Polyimide Copper Clad Laminate for Flex PCBs
Flexible copper clad laminate using polyimide film backed with refined copper foil ≤0.15mm thick, designed for flexible printed circuits. The copper provides conductive layers on the polymer backing. Classified under HTS 7410.21.3060 as other backed copper clad laminates of refined copper.
Thin Flex Copper Clad Polyester Laminate
Ultra-thin polyester (PET) film backed with refined copper foil under 0.15mm for flexible circuitry in wearables. Provides bendable conductive substrate. HTS 7410.21.3060 covers this other backed copper clad laminate.
High-Tg Copper Clad Laminate for Automotive PCBs
High glass transition temperature (Tg) FR4 laminate clad with refined copper foil ≤0.15mm, engineered for automotive electronics under extreme conditions. Backed substrate for reliable circuit boards. HTS 7410.21.3060 classification.
Copper Clad Kapton Laminate for Aerospace
Kapton polyimide film clad with refined copper foil under 0.15mm for high-reliability aerospace flexible circuits. Withstands extreme temperatures/vibration. Fits 7410.21.3060 other category.
Single-Sided Copper Clad Phenolic Laminate
Phenolic paper substrate with single-sided refined copper foil ≤0.15mm cladding for low-cost consumer electronics PCBs. Economical backed laminate option. HTS 7410.21.3060 applies.
Megtron6 Copper Clad Laminate for Servers
Megtron6 low-loss laminate with refined copper foil ≤0.15mm for high-speed server/data center PCBs. Advanced backing for signal integrity. Under 7410.21.3060.