High-Tg Copper Clad Laminate for Automotive PCBs
High glass transition temperature (Tg) FR4 laminate clad with refined copper foil ≤0.15mm, engineered for automotive electronics under extreme conditions. Backed substrate for reliable circuit boards. HTS 7410.21.3060 classification.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If imported as vehicle electrical part
End-use assembly for autos may classify under Chapter 87 parts if beyond raw material.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Include Tg value (>170°C) and automotive specs (IATF 16949) in documentation
• Verify no halogen content for RoHS compliance declarations
Related Products under HTS 7410.21.30.60
Polyimide Copper Clad Laminate for Flex PCBs
Flexible copper clad laminate using polyimide film backed with refined copper foil ≤0.15mm thick, designed for flexible printed circuits. The copper provides conductive layers on the polymer backing. Classified under HTS 7410.21.3060 as other backed copper clad laminates of refined copper.
Thin Flex Copper Clad Polyester Laminate
Ultra-thin polyester (PET) film backed with refined copper foil under 0.15mm for flexible circuitry in wearables. Provides bendable conductive substrate. HTS 7410.21.3060 covers this other backed copper clad laminate.
Copper Clad Kapton Laminate for Aerospace
Kapton polyimide film clad with refined copper foil under 0.15mm for high-reliability aerospace flexible circuits. Withstands extreme temperatures/vibration. Fits 7410.21.3060 other category.
Single-Sided Copper Clad Phenolic Laminate
Phenolic paper substrate with single-sided refined copper foil ≤0.15mm cladding for low-cost consumer electronics PCBs. Economical backed laminate option. HTS 7410.21.3060 applies.
Megtron6 Copper Clad Laminate for Servers
Megtron6 low-loss laminate with refined copper foil ≤0.15mm for high-speed server/data center PCBs. Advanced backing for signal integrity. Under 7410.21.3060.
Teflon Copper Clad Laminate for RF
PTFE (Teflon) ceramic-filled laminate double-clad with refined copper foil ≤0.15mm for microwave/RF applications. Superior electrical properties. HTS 7410.21.3060.