High-Tg Copper Clad Laminate for Automotive PCBs from Japan
High glass transition temperature (Tg) FR4 laminate clad with refined copper foil ≤0.15mm, engineered for automotive electronics under extreme conditions. Backed substrate for reliable circuit boards. HTS 7410.21.3060 classification.
Duty Rate — Japan → United States
13%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include Tg value (>170°C) and automotive specs (IATF 16949) in documentation
• Verify no halogen content for RoHS compliance declarations