High-Tg Copper Clad Laminate for Automotive PCBs from China
High glass transition temperature (Tg) FR4 laminate clad with refined copper foil ≤0.15mm, engineered for automotive electronics under extreme conditions. Backed substrate for reliable circuit boards. HTS 7410.21.3060 classification.
Duty Rate — China → United States
38%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Include Tg value (>170°C) and automotive specs (IATF 16949) in documentation
• Verify no halogen content for RoHS compliance declarations