Rogers RO4000 Series Copper Clad Laminate
High-frequency RO4000 hydrocarbon ceramic laminate sheets double-clad with refined copper foil ≤0.15mm, used in RF/microwave PCBs. The advanced backing enables low-loss signal performance. Fits HTS 7410.21.3060 for other refined copper clad laminates.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If of copper-nickel base alloys
Per note (d), nickel-predominant alloys without >1% zinc classify separately from refined copper.
If for semiconductor manufacturing use
End-use as electrical insulators/articles shifts to Chapter 85 if specialized beyond general PCB laminate.
If ceramic content predominant
If ceramic backing exceeds copper foil characteristics, may classify under Chapter 68 worked mineral products.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Include dielectric constant specs and copper weight (e.g
• 1oz/ft²) to verify suitability under thickness limit
• Certify no pre-imaging/etching; raw laminates only to stay in 7410 vs processed boards
Related Products under HTS 7410.21.30.60
Polyimide Copper Clad Laminate for Flex PCBs
Flexible copper clad laminate using polyimide film backed with refined copper foil ≤0.15mm thick, designed for flexible printed circuits. The copper provides conductive layers on the polymer backing. Classified under HTS 7410.21.3060 as other backed copper clad laminates of refined copper.
Thin Flex Copper Clad Polyester Laminate
Ultra-thin polyester (PET) film backed with refined copper foil under 0.15mm for flexible circuitry in wearables. Provides bendable conductive substrate. HTS 7410.21.3060 covers this other backed copper clad laminate.
High-Tg Copper Clad Laminate for Automotive PCBs
High glass transition temperature (Tg) FR4 laminate clad with refined copper foil ≤0.15mm, engineered for automotive electronics under extreme conditions. Backed substrate for reliable circuit boards. HTS 7410.21.3060 classification.
Copper Clad Kapton Laminate for Aerospace
Kapton polyimide film clad with refined copper foil under 0.15mm for high-reliability aerospace flexible circuits. Withstands extreme temperatures/vibration. Fits 7410.21.3060 other category.
Single-Sided Copper Clad Phenolic Laminate
Phenolic paper substrate with single-sided refined copper foil ≤0.15mm cladding for low-cost consumer electronics PCBs. Economical backed laminate option. HTS 7410.21.3060 applies.
Megtron6 Copper Clad Laminate for Servers
Megtron6 low-loss laminate with refined copper foil ≤0.15mm for high-speed server/data center PCBs. Advanced backing for signal integrity. Under 7410.21.3060.