Polyimide Copper Clad Laminate
High-temperature polyimide film backed with refined copper foil ≤0.15mm thick, used for flexible PCBs in electronics. Falls under HTS 7410.21.30 as backed copper foil specifically denoted as copper clad laminates with plastic backing. Refined copper per chapter alloy definitions.
Import Duty Rates by Country of Origin
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If backed but not specifically 'copper clad laminates'
Other backed refined copper foils exclude dedicated laminate subheading; depends on exact product description.
If imported as polyimide film with incidental copper
Primarily plastic film by composition and use shifts to Chapter 39 plates/sheets, not copper foil heading.
If using copper-nickel or brass alloys
Nickel silvers or brasses per subheading note (c) classify separately from refined copper clad laminates.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Include dielectric constant and peel strength test data in documentation to prove laminate construction
• Ensure declaration specifies 'refined copper foil backed with polyimide' to distinguish from bare polyimide film
Related Products under HTS 7410.21.30
Aluminum-Backed Copper Clad Laminate
Refined copper foil laminated to thin aluminum substrate for metal-core PCBs in LED lighting, foil ≤0.15mm. Still HTS 7410.21.30 as copper foil backed with metal-like 'similar backing materials' per heading.
Double-Sided 1.6mm FR4 Copper Clad Laminate
Standard 1.6mm thick FR4 laminate with refined copper foil on both sides (total foil <0.15mm), industry workhorse for PCBs. HTS 7410.21.30 for copper clad laminates of refined copper foil.
Thin Flex Copper Clad Polyimide Laminate
Ultra-thin polyimide copper clad laminate for flexible circuits, refined copper foil ≤0.15mm with adhesive backing. Classified HTS 7410.21.30 as backed refined copper clad laminates.
High-Tg FR4 Copper Clad Laminate
FR4 laminate with high glass transition temperature for lead-free soldering, clad with refined copper foil <0.15mm. HTS 7410.21.30 applies to all such refined copper clad laminates.
Copper Clad Invincible Laminate for RF
Specialty ceramic-filled laminate for RF applications with refined copper cladding ≤0.15mm thickness. Under HTS 7410.21.30 as plastics/similar backed copper clad laminates.
Rogers RO4000 Series Copper Clad Laminate
High-frequency PTFE-based laminate from Rogers Corporation clad with refined copper foil <0.15mm for RF/microwave PCBs. Specifically classified under HTS 7410.21.30 for refined copper clad laminates with plastics backing.